ACS-011 Wafer Grinding for Integrated Circuits

This case study discusses the use of filtration in the semiconductor wafer manufacturing industry, specifically in the process of wafer backgrinding for integrated circuits.

The production of integrated circuits requires silicon wafers with high flatness, ground before dicing into microchips. Wafer back-grinding uses a diamond and resin grind wheel on a rotating vacuum chuck, with continuous water washing. The process involves a coarse grind followed by a fine grind for different finishes like 1200 grit, 2000 grit, poligrind, and polish. A case study of a semiconductor wafer manufacturer in California shows the use of filtration, starting with a 1-micron bag filter and transitioning to a 0.45 PME Series and 0.2-micron PME Series for improved water cleanliness, reducing defects and increasing product yield.

  • Silicon wafers need high flatness for integrated circuits
  • Wafer back-grinding involves grinding wafers before dicing
  • Process includes coarse and fine grinding for different finishes
  • Case study shows the use of filtration for water in the process
  • Transition from bag filters to PME Series for improved water cleanliness
  • Resulted in fewer defects, higher product yield, and process improvement

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