Graver Technlogies provides technology to trace contaminants in microelectronic devices such as transistors, capacitors, resistors, LEDs, pacemakers or flat screens.
Microelectronic devices such as transistors, capacitors, resistors, LEDs, or flat screens touch every aspect of daily life. From cell phones and computers to pacemakers and hearing aids, to automobiles and jet fighters, the reliable performance of the component, particularly in critical applications, is extremely important. Trace contaminants can reduce yields or result in failure of the device, leading to higher manufacturing costs or poor product quality that could make the product a commercial failure. Sources of contaminants in the manufacturing environment stem from personnel, air, process chemicals, water, or equipment. Each must be managed to reduce the risk in order to optimize product quality and yield.
Highly efficient filtration of sub-micron particles is essential for maximizing yields by reducing defects throughout production processes in all microelectronics applications. Graver Technologies provides an extensive line of filtration technologies to protect these critical processes such as photolithography, CMP or wet-etch that are used to produce semiconductors, flat panel displays or data storage devices. By removing particles from upstream sources such as ultra-high purity water or electronic grade chemicals, we are able to reduce manufacturing downtime, help optimize operating and maintenance costs, extend chemical life and reduce the risk of defects which leads to maximized product yields and quality for efficient and economical device manufacturing. We manufacture using a broad range of materials including PTFE, PFA, polyethersulfone and polypropylene to provide excellent chemical and temperature resistance.
In order to maximize the life of reverse osmosis membranes, it is highly recommended to use a filter in front of the membrane with the goals of reducing the risk of fouling the membrane. Membrane fouling is the main cause of permeate flux decline and loss of product quality in reverse osmosis systems. Silt Density Index or SDI (ASTM standard test method D 4189-82), is the empirical test developed for measuring the potential rate of fouling of RO membranes
Polishing of wafers is typically accomplished using a process called Chemical Mechanical Planarization, which uses a combination of chemical etching and abrasive polishing to achieve a flat surface.
CMP is a process used for smoothing the surfaces of semiconductor wafers using a combination of chemical and mechanical forces. The process uses chemical etching and abrasive polishing to achieve a flat surface.
A microprocessor is an integrated circuit, but not all integrated circuits are microprocessors. This acts as the brains, being able to process logical and arithmetic instructions that are programmed into it.
This is essentially the same as a microprocessor, an integrated circuit that behaves as the brain of the computer. Also referred to as the central processing unit, or CPU.
This broad category includes devices such as transistors, capacitors, resistors, diodes, LED and photocells. The different types of devices can be integrated together to form integrated circuits, or VLSI (Very Large Scale Integration) devices such as microprocessors and random access memory (RAM).
Copper and other metals are used as conductors in printed circuit boards. But for microelectronic devices it is difficult to properly control the electric signal and thus semiconductor material such as silicon is used which also insulates better.
Chemical vapor deposition (CVD) is a vacuum deposition method generally used for depositing crystalline micro/nano thin films and structures on wafers using materials such as silicon, carbon, fluorocarbons, tungsten and titanium nitride. Metal organic chemical vapor deposition (MOCVD), a variant of CVD, is most commonly used for the production of red, blue, green and white LEDs
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