Graver Technologies提供追踪微电子设备中的技术,例如晶体管、电容器、电阻器、LED、起重器和平面屏幕屏幕屏幕。
晶体管、电容器、电阻器、发光二极管或平板屏幕等微电子设备接触器及日常生活的方方面面。从手机和计算机到起音器和助听器,再到汽车和喷气式战斗机,该组合的可靠性能力,尤其在关键应用中,极端至关重要。微量分散物会降低低低产量或导致死设备屏障,而导致更高的成分本或不良的产品质量,而在商业上出现了屏障。制造环境中来自人员、分布空气、工业化学品、水或设备的物资。必须对每种产品进行管理以降低风险风险,以优化产品质量和产量。
亚微米粒子的高效过滤器通过减小所有微电子应用中整个生产过程中的缺陷陷来最大限度地提示高产量至关重要。Graver Technologies提供广义的过滤技术来保护这些关键工艺,例如用于生产半导体、平板显示器或数据存储设备的光刻、CMP或湿式的刻面。通过去除上游客(例如超高纯度水或电子级化学品)的中粒子,我们可以减少少量生产停机时间,帮助优化运营和维护成本,延缓缓长化学品寿命并降低缺陷风险风险,从最大限度提高高产品产量和数量,从实现高效、经济的设备制造。我们使用多种材质制造,包括聚四氟乙烯、PFA、聚丙烯和聚丙烯,以提供出色的耐化学性质和耐温性。
In order to maximize the life of reverse osmosis membranes, it is highly recommended to use a filter in front of the membrane with the goals of reducing the risk of fouling the membrane. Membrane fouling is the main cause of permeate flux decline and loss of product quality in reverse osmosis systems. Silt Density Index or SDI (ASTM standard test method D 4189-82), is the empirical test developed for measuring the potential rate of fouling of RO membranes
Chemical vapor deposition (CVD) is a vacuum deposition method generally used for depositing crystalline micro/nano thin films and structures on wafers using materials such as silicon, carbon, fluorocarbons, tungsten and titanium nitride. Metal organic chemical vapor deposition (MOCVD), a variant of CVD, is most commonly used for the production of red, blue, green and white LEDs
This broad category includes devices such as transistors, capacitors, resistors, diodes, LED and photocells. The different types of devices can be integrated together to form integrated circuits, or VLSI (Very Large Scale Integration) devices such as microprocessors and random access memory (RAM).
CMP is a process used for smoothing the surfaces of semiconductor wafers using a combination of chemical and mechanical forces. The process uses chemical etching and abrasive polishing to achieve a flat surface.
Polishing of wafers is typically accomplished using a process called Chemical Mechanical Planarization, which uses a combination of chemical etching and abrasive polishing to achieve a flat surface.
This is essentially the same as a microprocessor, an integrated circuit that behaves as the brain of the computer. Also referred to as the central processing unit, or CPU.
A microprocessor is an integrated circuit, but not all integrated circuits are microprocessors. This acts as the brains, being able to process logical and arithmetic instructions that are programmed into it.
Copper and other metals are used as conductors in printed circuit boards. But for microelectronic devices it is difficult to properly control the electric signal and thus semiconductor material such as silicon is used which also insulates better.
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